The Albany Nanotech Center in Albany is announcing the creation of a new Chemical Mechanical Planarization Center based at the Albany Nanotech Complex.

The goal of the center is to develop the next generation of CMP technology - which is a polishing process that uses chemicals combined with mechanical forces.

The new CMP Center is a joint collaboration between the newly merged SUNY College of Nanoscale Science and Engineering, Suny-IT and SEMATECH.

"The CMP Center is an important part of our strategy to provide our members with the critical capabilities needed to accelerate process maturity for end users," said Ed Barth, Director of Growth Initiatives at SEMATECH. "In addition to SEMATECH's network of consortium members, the newly merged CNSE/SUNYIT's leadership in providing state-of-the-art process and metrology toolsets will enable the development of new materials and CMP processes in furhter scaling of IC devices."


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